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ColdCon® 2017: MEGWARE Presents 100% Liquid Cooled HPC Solutions


16.06.2017

During this year’s ISC High Performance (http://www.isc-hpc.com) event, MEGWARE introduces the latest developments surrounding the innovative ColdCon® high temperature direct liquid cooling system. Thus, on June 20, 2017 at 10:00 at the Intel Booth F-903, MEGWARE CTO Axel Auweter will present the new version of MEGWARE’s SlideSX®-LC compute platform. This new version features updates to the latest Intel® Xeon® and Xeon® Phi technologies as well as liquid cooling for its power supplies. In addition, the presentation will display the extended power monitoring capabilities of SlideSX®-LC. Supplementing the modular ColdCon® cooling system, MEGWARE also introduces the first fully liquid-cooled variant of a 48-port Omni-Path switch. Together with the new SlideSX®-LC compute platform, this allows for a 100% liquid cooled, fanless HPC solution tailored to customer needs.



The Leibniz Supercomputing Centre (short LRZ) of the Bavarian Academy of Sciences and Humanities will be the first customer of the new technology. Their new CooLMUC-3 supercomputer will feature 148 nodes with Intel® Xeon® Phi 7210-F CPUs. "The completely liquid-cooled HPC solution is the next logical step for LRZ to further increase the energy-efficiency of our HPC systems,” explains Dr. Herbert Huber, Head of the High Performance Computing Division at LRZ.



All new products (including the new SlideSX-LC node design, the liquid cooled power supply, and the liquid cooled Intel® Omni-Path switch) will be on display at the MEGWARE Booth B-1330. We look forward to presenting to you the advantages of our new highly energy efficient ColdCon® technology and its potential scenarios for heat-reuse. Come see us in Frankfurt/Main or get in touch online. We are looking forward to meeting you!

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