ISC Conference 2017 - successful exhibition for MEGWARE
This year’s International Supercomputing Conference (ISC), taking place from June 19 to 21, 2017 in Frankfurt/Main, once again was a very successful fair for MEGWARE. With more than 3,253 guests from over 60 countries the exhibition set a new visitor record.
MEGWARE introduced the latest developments surrounding the innovative ColdCon® high temperature direct liquid cooling system at Booth B-1330. Especially the new version of MEGWARE’s SlideSX®-LC liquid-cooled HPC compute node based on latest Intel® Xeon® ‘Knights Landing’ technology was of great interest of numerous visitors. Within the current CooLMUC-3 project at Leibniz Supercomputing Centre Garching, 148 SlideSX®-LC nodes with Intel® Xeon® Phi 7210-F processor will be used to ensure a high energy-efficient computation operation on-site. As further development, liquid-cooled power supplies, which be part of the new MEGWARE SlideSX®-LC server chassis, as well as the first fully liquid-cooled variant of a 48-port Intel® Omni-Path switch has been presented for the first time. With these innovations of the modular ColdCon® cooling system, 100% liquid cooled, fanless HPC cluster installations can be realized.
“With our new developments we offer a wide range of innovative and application specific HPC solutions to our customers. With the very positive feedback here at the fair, we are looking forward to upcoming projects and we want to place another MEGWARE cluster in the next TOP500 list of world.
MEGWARE would like to thank all visitors, customers and partners for the numerous interesting discussions. At the upcoming Supercomputing Conference, taking place from November 13 to 16, 2017 in Denver, MEGWARE once again will be exhibitor at Numascale Booth #1231