The modular MEGWARE server housing SlideSX® has been developed for the vertical installation of up to ten compute or five GPU node housings in five 19” rack units. This high packing density enables the installation of up to 80 compute nodes or 40 GPU nodes in a 42 RU cabinet. The housing is based on compatible, hot plug-compliant components, whereby individual node slots or power supply units can be autonomously removed from the overall housing and maintained. To achieve an efficient PSU load, we offer freely selectable configurations with 3+1 or 4+1 redundancies.
The 19” chassis also comes with a dedicated management interface, which enables you to read system parameters and manage the integrated slots. The housings can be equipped with a cooling infrastructure, also developed in-house. Thanks to top-quality copper piping, the latest compute platform SlideSX-LC enables the direct transfer of heat from central system components such as the CPU, main memory, or chipset. The latest version of the hot water direct-cooling system ColdCon® is integrated on Intel® Server Board S2600BPB and enable high-efficient cooling of the highest performance Intel® Xeon® Scalable Processors. Due to its individual components, the server housing is perfect for continuous operation in data centers, and thereby makes for high availability of the compute resources.
SlideSX®-LC offers efficient direct cooling for HPC compute nodes with the highest performance Intel® Xeon® CPUs, combining maximum compute performance with minimum space thanks to the high power density. Direct water cooling permits direct extraction of the heat produced in the compute nodes. Each compute node slot in the liquid cooling (LC) model is fitted with a cooling unit for direct liquid cooling. Liquid-cooled elements directly transfer the waste heat from each component into the water circuit. Thus, the fanless compute nodes save energy and reduce noise emission in the data centre.
The system operates at high water temperatures and therefore allows energy-efficient free cooling throughout the year. The waste heat can be reused to produce hot water or support the existing heating infrastructure. SlideSX®-LC is just as service-friendly as the air-cooled version. Each of the directly cooled compute nodes can be removed and reintegrated by hotswap for maintenance purposes. The system is connected to the cooling circuit via automatic leak-free connectors in the backplane. SlideSX® ist Intel® Cluster Ready certified.